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1 proximity sensor with intelligent interrupt and sleep modes ISL29027 the ISL29027 is an integrated infrared light-to-digital converter with a built-in ir led driver and i 2 c interface (smbus compatible). the flexible interrupt scheme is designed for minimal microcontroller utilization. for proximity sensor (prox) data conversions, the built-in driver turns on an external infrared led and the proximity sensor adc converts the reflected ir intensity to digital. this adc rejects ambient ir noise (such as sunlight) and has a 540 s conversion time. the ISL29027 provides proximity sensing with a typical 138 a normal operation current (110 a for sensors and internal circuitry, ~28 a for external led) with 220ma current pulses for a net 100 s, repeating every 800ms (or under). the ISL29027 uses both a hardware pin and software bits to indicate an interrupt event has occurred. a proximity interrupt is defined as a measurement over a threshold limit. the user may also require that proximity inte rrupts occur at once, up to 16 times in a row before acti vating the interrupt pin. the ISL29027 is designed to operate from 2.25v to 3.63v over the -40c to +85c ambient temperature range. it is packaged in a clear, lead-free 8 lead odfn package. applications - mobile devices: smart phone, pda, gps - computing devices: laptop pc, netbook - consumer devices: lcd-tv, digital picture frame, digital camera features ? works under all light sources including sunlight ? intelligent interrupt scheme simplifies c code proximity sensing ? proximity sensor with broad ir spectrum - can use 850nm and 950nm external ir leds ?ir led driver with i 2 c programmable sink currents -net 100 s pulse with 110ma or 220ma amplitudes - periodic sleep time up to 800ms between pulses ? ambient ir noise cancellation (including sunlight) intelligent and flexible interrupts ? proximity interrupt thresholds ? adjustable interrupt persistency - 1/4/8/16 consecutive triggers required before interrupt ultra low power ?138 a dc typical supply current for prox sensing -110 a for sensors and internal circuitry -28 a typical current for external ir led (assuming 220ma for 100 s every 800ms) ?<1.0 a supply current when powered down easy to use ? set registers; wait for interrupt ?i 2 c (smbus compatible) output ? temperature compensated ? tiny odfn8 2.0x2.1x0.7 (mm) package additional features ? 1.7v to 3.63v supply for i 2 c interface ? 2.25v to 3.63v sensor power supply ? pb-free (rohs compliant) ?i 2 c address selection pin rext gnd scl ir photodiode light data 4 3 5 2 fosc iref irdr array process als and ir channel adc 8 int 7 command register data register i 2 c ir driver interrupt sda 6 addr0 1 figure 1. block diagram february 7, 2011 fn7815.0 caution: these devices are sensitive to electrostatic discharge; follow proper ic handling procedures. 1-888-intersil or 1-888-468-3774 | copyright intersil americas inc. 2011. all rights reserved intersil (and design) is a trademark owned by intersil corporation or one of its subsidiaries. all other trademarks mentioned are the property of their respective owners.
ISL29027 2 fn7815.0 february 7, 2011 pin configuration ISL29027 8 ld odfn (2.0mm x 2.1mm x 0.7 mm ) top view 1 2 3 8 7 6 addr0 vdd gnd irdr int sda 4 5 rext scl thermal pad *thermal pad can be connected to gnd or electrically isolated pin descriptions pin number pin name description 0 t.pad thermal pad (connect to gnd or float) 1addr0i 2 c address pin - pull high or low (do not float) 2 vdd positive supply: 2.25v to 3.63v 3gndground 4 rext external resistor (499 k ; 1%) connects this pin to ground 5scli 2 c clock line the i 2 c bus lines can be pulled from 1.7v to above v dd , 3.63v max 6sdai 2 c data line 7int interrupt pin; logic output (open-drain) for interrupt 8 irdr ir led driver pin - current flows into ISL29027 from led cathode ordering information part number (notes 1, 2, 3) temp. range (c) package tape & reel (pb-free) pkg. dwg. # ISL29027iroz-t7 -40 to +85 8 ld odfn l8.2.1x2.0 notes: 1. please refer to tb347 for details on reel specifications. 2. these intersil pb-free plastic packaged products employ specia l pb-free material sets; molding compounds/die attach materials and nipdau plate - e4 termination finish, which is rohs compliant and compatible with both snpb and pb-free soldering operations. intersil pb-free products are msl classified at pb-free peak reflow temp eratures that meet or exceed the pb-fr ee requirements of ipc/jedec j std-020. 3. for moisture sensitivity level (msl), please see device information page for ISL29027 . for more information on msl, please see technical brief tb363 .
ISL29027 3 fn7815.0 february 7, 2011 absolute maximum ratings (t a = +25 c) thermal information v dd supply voltage between v dd and gnd . . . . . . . . . . . . . . . . . . . . . .4.0v i 2 c bus pin voltage (scl, sda). . . . . . . . . . . . . . . . . . . . . . . . . -0.5v to 4.0v i 2 c bus pin current (scl, sda). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <10ma r ext pin voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5v to vdd + 0.5v irdr pin voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5.5v addr0 pin voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5v to vdd + 0.5v int pin voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5v to 4.0v int pin current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <10ma esd rating human body model (note 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2kv thermal resistance (typical) ja (c/w) jc (c/w) 8 ld odfn package (notes 4, 5) . . . . . . . . 88 10 maximum die temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +90c storage temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40c to +100c operating temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40c to +85c pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below http://www.intersil.com/ pbfree/pb-freereflow.asp caution: do not operate at or near the maximum ratings listed for extended periods of time. exposure to such conditions may adv ersely impact product reliability and result in failures not covered by warranty. notes: 4. ja is measured in free air with the componen t mounted on a high effective thermal conduc tivity test board with ?direct attach? fe atures. see tech brief tb379. 5. for jc , the ?case temp? location is the center of the exposed metal pad on the package underside. 6. esd on all pins is 2kv except for irdr, which is 1.5kv. important note: all parameters having min/max specifications are guaranteed. typical values are for information purposes only. u nless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: t j = t c = t a electrical specifications v dd = 3.0v, t a = +25c, r ext = 499k 1% tolerance. parameter description condition min (note 9) typ max (note 9) unit v dd power supply range 2.25 3.0 3.63 v sr_v dd input power-up slew rate v dd rising edge between 0.4v and 2.25v 0.5 v/ms i dd_off supply current when powered down prox_en = 0 0.1 0.8 a i dd_prx_slp supply current for prox in sleep time prox_en = 1 80 a f osc internal oscillator frequency 5.25 mhz t intgr_prox 8-bit prox integration/conversion time 0.54 ms data prox_0 prox measurement w/o object in path 12counts data prox_f full scale prox adc code 255 counts data prox_1 prox measurement result (note 7) 36 46 56 counts t r rise time for ir dr sink current r load = 15 at irdr pin, 20% to 80% 500 ns t f fall time for ir dr sink current r load = 15 at irdr pin, 80% to 20% 500 ns i irdr_0 irdr sink current prox_dr = 0; v irdr = 0.5v 95 110 125 ma i irdr_1 irdr sink current prox_dr = 1; v irdr = 0.5v 220 ma i irdr_leak irdr leakage current prox_en = 0; v dd = 3.63v (note 8) 0.001 1 a v irdr acceptable voltage range on irdr pin register bit prox_dr = 0 0.5 4.3 v t pulse net i irdr on time per prox reading 100 s v ref voltage of r ext pin 0.51 v f i2c i 2 c clock rate range 400 khz v i2c supply voltage range for i 2 c interface 1.7 3.63 v v il scl and sda input low voltage 0.55 v v ih scl and sda input high voltage 1.25 v i sda sda current sinking capability v ol = 0.4v 3 5 ma i int int current sinking capability v ol = 0.4v 3 5 ma
ISL29027 4 fn7815.0 february 7, 2011 psrr irdr ( i irdr )/( v irdr ) prox_dr = 0; v irdr = 0.5v to 4.3v 4 ma/v notes: 7. an 850nm infrared led is used to test prox /ir sensitivity in an internal test mode. 8. ability to guarantee i irdr leakage of ~1na is limited by test hardware. . 9. compliance to datasheet limits is assu red by one or more methods: production test, characterization and/or design. electrical specifications v dd = 3.0v, t a = +25c, r ext = 499k 1% tolerance. (continued) parameter description condition min (note 9) typ max (note 9) unit i 2 c electrical specifications for scl and sda unless otherwise noted, v dd = 3v, t a = +25c, r ext = 499k 1% tolerance (note 10). parameter description condition min typ max unit v i2c supply voltage range for i 2 c interface 1.7 3.63 v f scl scl clock frequency 400 khz v il scl and sda input low voltage 0.55 v v ih scl and sda input high voltage 1.25 v v hys hysteresis of schmitt trigger input 0.05v dd v v ol low-level output voltage (open-drain) at 4ma sink current 0.4 v i i input leakage for each sda, scl pin -10 10 a t sp pulse width of spikes that must be suppressed by the input filter 50 ns t aa scl falling edge to sda output data valid 900 ns c i capacitance for each sda and scl pin 10 pf t hd:sta hold time (repeated) start condition after this period, the first clock pulse is generated 600 ns t low low period of the scl clock measured at the 30% of vdd crossing 1300 ns t high high period of the scl clock 600 ns t su:sta set-up time for a repeated start condition 600 ns t hd:dat data hold time 30 ns t su:dat data set-up time 100 ns t r rise time of both sda and scl signals (note 11) 20 + 0.1xc b ns t f fall time of both sda and scl signals (note 11) 20 + 0.1xc b ns t su:sto set-up time for stop condition 600 ns t buf bus free time between a stop and start condition 1300 ns c b capacitive load for each bus line 400 pf r pull-up sda and scl system bus pull-up resistor maximum is determined by t r and t f 1k t vd;dat data valid time 0.9 s t vd:ack data valid acknowledge time 0.9 s v nl noise margin at the low level 0.1vdd v v nh noise margin at the high level 0.2vdd v notes: 10. all parameters in i 2 c electrical specifications table are guaranteed by design and simulation. 11. cb is the capacitance of the bus in pf.
ISL29027 5 fn7815.0 february 7, 2011 register map there are ten 8-bit regi sters accessible via i 2 c. registers 0x1 and 0x2 define the operation mode of the device. registers 0x3 and 0x4 store the various prox thresholds which trigger interrupt events. registers 0x8 store the results of prox adc conversions. figure 2. i 2 c timing diagram table 1. isl29028a registers and register bits addr reg name bit 7654321 0default 0x00 (n/a) (reserved) (n/a) 0x01 configure prox en prox_slp[2:0] prox_dr (write 0) (write0) (write0) 0x00 0x02 interrupt prox_flag prox_prst[1:0] (write 0) (write0) (write 0) (write 0) 0x00 0x03 prox_lt prox_lt[7:0] 0x00 0x04 prox_ht prox_ht[7:0] 0xff 0x05 (n/a) (reserved) (n/a) 0x06 (n/a) (reserved) (n/a) 0x07 (n/a) (reserved) (n/a) 0x08 prox_data prox_data[7:0] 0x00 0x09 (n/a) (reserved) (n/a) 0x0a (n/a) (reserved) (n/a) 0x0e test1 (write as 0x00) 0x00 0x0f test2 (write as 0x00) 0x00
ISL29027 6 fn7815.0 february 7, 2011 register descriptions table 2. register 0x00 (reserved) bit # access default name function/operation 7:0 ro (n/a) (n/a) reserved - no need to read or write table 3. register 0x01 (configure) - prox configuration bit # access default name function/operation 7rw0x00 prox_en (prox enable) when = 0, proximity sensing is disabled when = 1, continuous proximity sensing is enable d. prox data will be ready 0.54ms after this bit is set high 6:4 rw 0x00 prox_slp (prox sleep) for bits 6:4 = (see the following) 111; sleep time between prox ir led pulses is 0.0ms (run continuously) 110; sleep time between prox ir led pulses is 12.5ms 101; sleep time between prox ir led pulses is 50ms 100; sleep time between prox ir led pulses is 75ms 011; sleep time between prox ir led pulses is 100ms 010; sleep time between prox ir led pulses is 200ms 001; sleep time between pr ox ir led pulses is 400ms 000; sleep time between prox ir led pulses is 800ms 3rw0x00 prox_dr (prox drive) when = 0, irdr behaves as a pulsed 110ma current sink when = 1, irdr behaves as a pulsed 220ma current sink 2rw0x00 unused (write 0) unused register bit (write 0) 1rw0x00 unused (write 0) unused register bit (write 0) 0rw0x00 unused (write 0) unused register bit (write 0) table 4. register 0x02 (interru pt) - prox interrupt control bit # access default bit name function/operation 7flag0x00 prox_flag (prox flag) when = 0, no prox interrupt event has occurred since power-on or last ?clear? when = 1, a prox interrupt event occurred. clearable by writing ?0? 6:5 rw 0x00 prox_prst (prox persist) for bits 6:5 = (see the following) 00; set prox_flag if 1 conversion result trips the threshold value 01; set prox_flag if 4 conversion results trip the threshold value 10; set prox_flag if 8 conversion results trip the threshold value 11; set prox_flag if 16 conversion results trip the threshold value 4rw0x00 unused (write 0) unused register bit - write 0 3rw0x00 unused (write 0) unused register bit - write 0 2:1 rw 0x00 unused (write 0) unused register bit - write 0 0rw0x00 unused (write 0) unused register bit - write 0 table 5. register 0x03 (prox_lt) - interrupt low threshold for proximity sensor bit # access default bit name function/operation 7:0 rw 0x00 prox_lt (prox threshold) 8-bit interrupt low threshold for proximity sensing
ISL29027 7 fn7815.0 february 7, 2011 principles of operation i 2 c interface the ISL29027?s i 2 c interface slave address is internally hardwired as 0b100010, where ?0b? si gnifies binary notation and x represents the logic level on pin addr0. figure 3 shows a sample one-byte read. the i 2 c bus master always drives the scl (clock) line, while either the master or the slave can drive the sda (data) line. every i 2 c transaction begins with the master asserting a start condition (sda falling while scl remains high). the first transmitted byte is initiated by the master and includes 7 address bits and a r/w bit. the slave is responsible for pulling sda low during the ack bit after every transmitted byte. each i 2 c transaction ends with the master asserting a stop condition (sda rising wh ile scl remains high). for more information about the i 2 c standard, please consult the philips? i 2 c specification documents. photodiodes and adcs the ISL29027 contains photodiode arrays which convert photons (light) into current. the proximity sensor is an 8-bit adc. when proximity sensing is enabled, the irdr pin will drive a user- supplied infrared led, the emitted ir reflects off an object (i.e., a human head) back into the isl290 27, and a sensor converts the reflected ir wave to a current signal in 0.54ms. the adc subtracts the ir reading before and after the led is driven (to remove ambient ir such as sunlight), and converts this value to a digital count stored in register 0x8. because of the conversion times, the user must let the adcs perform one full conversion first before reading from i 2 c registers prox_data (wait 0.54ms). the proximity sensor runs continuously with a time between conversions decided by prox_slp (register 1 bits [6:4]).(as shown in figure 4). proximity sensing when proximity sensing is enabled (prox_en = 1), the external ir led is driven for 0.1ms by the built-in ir led driver through the irdr pin. the amplitude of the ir led current depends on register 1 bit 3: prox_dr. if this bit is low, the load will see a table 6. register 0x04 (prox_ht) - interrupt high threshold for proximity sensor bit # access default bit name function/operation 7:0 rw 0xff prox_ht (prox threshold) 8-bit interrupt high threshold for proximity sensing table 7. register 0x08 (prox_da ta) - proximity sensor data bit # access default bit name function/operation 7:0 ro 0x00 prox_data (proximity data) results of 8-bit proximity sensor adc conversion table 8. register 0x0e (test1) - test mode bit # access default bit name function/operation 7:0 rw 0x00 (write as 0x00) test mode register. when 0x00, in normal operation table 9. register 0x0f (test2) - test mode 2 bit # access default bit name function/operation 7:0 rw 0x00 (write as 0x00) test mode register. when 0x00, in normal operation figure 3. i 2 c driver timing diagram for master and slave connected to common bus start w a a a6 a5 a4 a3 a2 a1 a0 w a r7 r6 r5 r4 r3 r2 r1 r0 a a6 a5 a4 a3 a2 a1 a0 w a a a a d7 d6d5d4 d3d2 d1d0 1357 1357 123456 9246 stop start sda driven by master device address sda driven by ISL29027 data byte0 register address slave device address i 2 c data sda driven by master sda driven by master 2468 924689 78135789 i 2 c sda i 2 c sda i 2 c clk master (ISL29027) figure 4. current drive mode options prox sensor active irdr (current driver) 0.54ms for prox conversion series of current pulses totaling 0.1ms sleep time (prox_slp) time time
ISL29027 8 fn7815.0 february 7, 2011 fixed 110ma current pulse. if this bit is high, the load on irdr will see a fixed 220ma current pulse as seen in figure 5. when the ir from the led reache s an object and gets reflected back into the ISL29027, the reflected ir light is converted into current as per the ir spectral re sponse shown in figure 7. one entire proximity measurement takes 0.54ms for one conversion (which includes 0.1ms spent dr iving the led), and the period between proximity measurements is decided by prox_slp (sleep time) in (register 1 bits 6:4). average led driving current consumption is given by equation 1. a typical irdr scheme is 220m a amplitude pulses every 800ms, which yields 28 a dc. total current consumption total current consumption is the sum of idd and iirdr. the irdr pin sinks current (as shown in fi gure 5) and the average irdr current can be calculated usin g equation 1. idd depends on voltage and the mode-of-operat ion, as seen in figure 9. interrupt function the ISL29027 has an intelligent interrupt scheme designed to shift some logic processing away from intensive microcontroller i 2 c polling routines (which consume power) and towards a more independent light sensor, which can instruct a system to ?wake up? or ?go to sleep?. a proximity interrupt event (prox_flag) is governed by the high and low thresholds in registers 3 and 4 (prox_lt and prox_ht). prox_flag is set when the measured proximity data is more than the higher threshold x-times-in-a-row (x is set by user; see next paragraph). the proximity interrupt flag is cleared when the prox data is lower than the low proximity threshold x-times-in-a-row, or when the user writes ?0? to prox_flag. interrupt persistency is another useful option available for proximity measurements. persistency requires x-in-a-row interrupt flags before the int pin is driven low. prox have their own independent interrupt persistency options. see prox_prst bits in register 2. vdd power-up and power supply considerations upon power-up, please ensure a vdd slew rate of 0.5v/ms or greater. after power-up, or if the user?s power supply temporarily deviates from our specification (2.25v to 3.63v), intersil recommends the user write the following: write 0x00 to register 0x01, write 0x29 to register 0x0f, write 0x00 to register 0x0e, and write 0x00 to register 0x0f. the user should then wait ~1ms or more and then rewrite all registers to the desired values. if the user prefers a hardware reset method instead of writing to test registers: set vdd = 0v for 1 second or more, power back up at the required slew rate, and write registers to the desired values. power-down to put the ISL29027 into a power-down state, the user can set prox_en bits to 0 in register 1. or more simply, set all of register 1 to 0x00. noise rejection charge balancing adc?s have excellent noise-rejection characteristics for periodic nois e sources whose frequency is an integer multiple of the conversion rate. for instance, a 60hz ac unwanted signal?s sum from 0ms to k*16.66ms (k = 1,2...ki) is zero. similarly, setting the device?s in tegration time to be an integer multiple of the periodic noise signal greatly improves the light sensor output signal in the presen ce of noise. since wall sockets may output at 60hz or 50hz, our integration time is 0.54ms: the lowest common integer number of cycles for both frequencies. proximity detection of various objects proximity sensing relies on the amount of ir reflected back from objects. a perfectly black object would absorb all light and reflect no photons. the ISL29027 is sensit ive enough to detect black esd foam which reflects only 1% of ir. for biological objects, blonde hair reflects more than brown hair and customers may notice that skin tissue is much more reflecti ve than hair. ir penetrates into the skin and is reflected or scatte red back from within. as a result, the proximity count peaks at contact and monotonically decreases as skin moves away. the reflective characteristics of skin are very different from that of paper. figure 5. current drive mode options pin 8 - irdr 220ma (prox_dr = 1) (irdr is hi-z when not driving) 110ma (prox_dr = 0) i lrdr ave ; i lrdr peak ; 100 s t sleep ----------------------------------------------------- = (eq. 1)
ISL29027 9 fn7815.0 february 7, 2011 typical circuit a typical application for the ISL29027 is shown in figure 6. the ISL29027?s i 2 c address is internally hardwired as 0b100010, with x representing the logic state of input i 2 c address pin addr0. the device can be tied onto a system?s i 2 c bus together with other i 2 c compliant devices. soldering considerations convection heating is recommende d for reflow soldering; direct- infrared heating is not recommended. the plastic odfn package does not require a custom reflow soldering profile, and is qualified to +260c. a standard reflow soldering profile with a +260c maximum is recommended. suggested pcb footprint it is important that users check the ?surface mount assembly guidelines for optical dual flat pack no lead (odfn) package? before starting odfn product board mounting. http://www.intersil.com/data/tb/tb477.pdf layout considerations the ISL29027 is relatively insensitive to layout. like other i2c devices, it is intended to provide excellent performance even in significantly noisy environments. there are only a few considerations that will ensure best performance. route the supply and i 2 c traces as far as possible from all sources of noise. 0.1f and 1f power supply decoupling capacitors need to be placed close to the device. addr0 1 gnd 3 rext 4 sda int 7 irdr 8 ISL29027 r1 10k ? r2 10k ? rext 499k ? v dd microcontroller int sda slave_0 slave_1 i 2 c slave_n i 2 c master scl sda scl sda v i2c_pull-up 6 r3 10k ? scl 2 vdd 5 c2 0.1f figure 6. ISL29027 typical circuit scl c1 1f v ir-led
ISL29027 10 fn7815.0 february 7, 2011 typical performance curves v dd = 3.0v, r ext = 499k ? figure 7. ISL29027 sensitivity to different wavelength s figure 8. prox counts vs distance with 10cm x 10cm reflector (using isl29028 evaluation board) figure 9. v dd vs i dd for various modes of operation figure 10. irdr pulse amplitude vs v irdr 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 300 400 500 600 700 800 900 1000 1100 wavelength (nm) normalized response human eye prox 0 50 100 150 200 250 300 0 20 40 60 80 100 120 140 160 180 200 distance (mm) prox counts (8-bit) white copy paper 220ma mode 18% grey card 110ma mode 40 80 100 120 140 160 2.25 2.40 2.55 2.85 3.00 3.15 3.45 input v dd (v) measured i dd (a) 3.60 3.30 2.70 60 prox (during sleep mode) 100 120 140 160 180 200 220 240 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 220ma-mode (prox_dr = 1) 110ma-mode (prox_dr = 0) v irdr (v) i irdr (ma)
ISL29027 11 fn7815.0 february 7, 2011 figure 11. 8 ld odfn sensor location outline - dimensions in mm 2.00 sensor offset 0.43 0.50 2.10 1 2 3 4 8 7 6 5 0.42
ISL29027 12 intersil products are manufactured, assembled and tested utilizing iso9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality intersil products are sold by description only. intersil corporat ion reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnished by intersil is believed to be accurate and reliable. however, no responsi bility is assumed by intersil or its subsid iaries for its use; nor for any infringem ents of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of i ntersil or its subsidiaries. for information regarding intersil corporation and its products, see www.intersil.com fn7815.0 february 7, 2011 for additional products, see www.intersil.com/product_tree products intersil corporation is a leader in the design and manufacture of high-performance analog semico nductors. the company's product s address some of the industry's fastest growing markets, such as , flat panel displays, cell phones, handheld products, and noteb ooks. intersil's product families address power management and analog sign al processing functions. go to www.intersil.com/products for a complete list of intersil product families. *for a complete listing of applications, related documentation an d related parts, please see the respective device information page on intersil.com: ISL29027 to report errors or suggestions for this datasheet, please go to: www.intersil.com/askourstaff fits are available from our website at: http://rel.intersil.com/reports/sear revision history the revision history provided is for inform ational purposes only and is believed to be accurate, but not warranted. please go t o web to make sure you have the latest rev. date revision change 2/7/11 fn7815.0 initial release.
ISL29027 13 fn7815.0 february 7, 2011 package outline drawing l8.2.1x2.0 8 lead optical dual flat no-lead plastic package (odfn) rev 2, 12/10 located within the zone indicated. the pin #1 indentifier may be unless otherwise specified, tolerance : decimal 0.05 tiebar shown (if present) is a non-functional feature. the configuration of the pin #1 id entifier is optional, but must be between 0.25mm and 0.35mm from the terminal tip. dimension b applies to the metallized terminal and is measured dimensions in ( ) for reference only. dimensioning and tolerancing conform to asme y14.5m-1994. 6. either a mold or mark feature. 3. 5. 4. 2. dimensions are in millimeters. 1. notes: detail "x" side view typical recommended land pattern top view (2x) 0.10 index area pin 1 a b 8x 0 . 35 0 . 05 b 0.10 a c c seating plane base plane 0.08 0.10 see detail "x" c c 6 0.200.05 1.50 0.50 0.75 1.50 m 0 . 00 min. 0 . 05 max. 0 . 2 ref c 5 0.700.05 2.10 2.00 (6x0.50) (8x0.20) (8x0.55) (0.75) (1.50) 2.10 2.50 (8x0.20) index area pin 1 6 bottom view 0.15 0.25

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